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1 A review of typical thermal fatigue failure models for solder joints of electronic components [会议论文]

作者:Li, Xiaoyan^1, Sun, Ruifeng^1, Wang, Yongdong^1

关键词:Cyclic plastic strain;Elastic strain;...

会议举办机构:China Aero-Polytechnology Establishment, Beijing, China^1

会议时间:2017

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